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| ILX533KB 2700 pixel x 3 line CCD Linear Sensor (Color) For the availability of this product, please contact the sales office. Description The ILX533KB is a reduction type CCD linear sensor developed for color image scanner. The distance between lines is only 4 line (32m). This sensor reads A4-size documents at a density of 300DPI. Features * Number of effective pixels: 8100 pixels (2700 pixels x 3) * Pixel size: 8m x 8m (8m pitch) * Distance between line: 32m (4 Lines) * Number of output 3 (R, G, B) * Single-sided readout * Clamp circuit are on-chip * Ultra high sensitivity/Ultra low lag * Single 12V power supply * Maximum data rate: 9MHz (3MHz x 3) * Input Clock Pulse: CMOS 5V drive * Package: 22 pin Plastic-DIP (400 mil) Absolute Maximum Ratings * Supply voltage VDD 15 * Operating temperature -10 to +55 * Storage temperature -30 to +80 Pin Configuration (Top View) 22 pin DIP (Plastic) Block Diagram 12 ROG-G 13 ROG-R Driver Driver 11 ROG-B V C C 14 2 Driver S2700 S2700 Read Out Gate Read Out Gate Blue 1 1 1 CCD Register CCD Register VOUT-G VDD NC NC NC NC NC 3 4 5 6 20 VOUT-B 19 NC 18 NC D14 D15 CCD Register Clamp Pulse Generator 17 NC G R B Driver 7 8 9 16 NC 15 NC VDD VOUT-B 20 14 2 13 ROG-R 1 10 2700 2700 2700 ROG-B 11 12 ROG-G Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- VOUT-G 3 VOUT-R 2 E99605-PS GND 21 RS 4 1 Clamp D63 D15 D14 S1 Clamp D63 D14 D15 S1 Clamp D63 S1 VOUT-R 2 21 GND Red 1 22 GND Green RS Read Out Gate S2700 10 1 ILX533KB Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol RS VOUT-R VOUT-G VDD NC NC NC NC NC 1 ROG-B Description Clock pulse input Signal out (red) Signal out (green) 12V power supply NC NC NC NC NC Clock pulse input Clock pulse input Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol ROG-G ROG-R 2 NC NC NC NC NC VOUT-B GND GND Description Clock pulse input Clock pulse input Clock pulse input NC NC NC NC NC Signal out (blue) GND GND Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V Clock Characteristics Item Input capacity of 1, 2 Input capacity of RS Input capacity of ROG1 Symbol C1, C2 CRS CROG Min. -- -- -- Typ. 400 10 10 Max. -- -- -- Unit pF pF pF 1 It indicates that ROG-R, ROG-G, ROG-B as ROG. Clock Frequency Item 1, 2, RS Symbol f1, f2, fRS Min. -- Typ. 1 Max. 3 Unit MHz Input Clock Pulse Voltage Condition Item 1, 2, RS, ROG pulse voltage High level Low level Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V -2- ILX533KB Electrooptical Characteristics (Note 1) Ta = 25C, VDD = 12V, fRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm) Item Red Sensitivity Green Blue Sensitivity nonuniformity Saturation output voltage Red Saturation exposure Green Blue Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE ZO VOS Min. 6.2 12.3 7.5 -- 2.0 0.15 0.10 0.12 -- -- -- -- 92 -- -- Typ. 9.5 19 11.5 4 2.5 0.26 0.13 0.21 2 4 0.02 30 98 300 6.3 Max. 12.8 25.6 15.5 20 -- -- -- -- 5 12 -- 50 -- -- -- mV mV % mA % V Note 6 Note 6 Note 7 -- -- -- Note 8 lx * s Note 5 % V Note 3 Note 4 V/(lx * s) Note 2 Unit Remarks Note 1) In accordance with the given electrooptical characteristics, the black level is defined as the average value of D2, D3 to D12. 2) For the sensitivity test light is applied with a uniform intensity of illumination. 3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT-G = 500mV (Typ.) PRNU = (VMAX - VMIN) /2 VAVE x 100 [%] Where the 2700 pixels are divided into blocks of 100. The maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4) Use below the minimum value of the saturation output voltage. 5) Saturation exposure is defined as follows. SE = VSAT R Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6) Optical signal accumulated time int stands at 5ms. 7) VOUT-G = 500mV (Typ.) VOUT 8) Vos is defined as the right side. VOUT indicates VOUT-R, VOUT-G, and VOUT-B. VOS GND -3- Clock Timing Chart 1 ROG 3 4 2770 D63 S2698 D15 S2699 D64 D65 D62 D14 D61 D13 S1 5 0 1 5 0 2 5 0 RS 5 0 D3 1 2 D1 D2 -4- Optical black (49 pixels) Dummy signal (63 pixels) 1-line output period S2 VOUT Noto) The transfer pulses (1, 2) must have more than 2770 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B. S2700 D70 ILX533KB ILX533KB Clock Timing Chart 2 t4 t5 ROG t2 t6 t7 1 t1 t3 2 Clock Timing Chart 3 t7 1 t6 2 t14 t10 t9 RS t8 t13 VOUT t12 t11 -5- ILX533KB Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time RS pulse high level period RS, 1 pulse timing 1 RS pulse rise time RS pulse fall time Signal output delay time RS, 1/2 pulse timing 2 Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 Min. 50 800 800 0 0 0 0 50 80 0 0 -- -- 50 Typ. 100 1000 1000 5 5 20 20 2501 2501 10 10 70 10 2501 Max. -- -- -- 10 10 60 60 -- -- 30 30 -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 These timing is the recommended condition under fRS = 1MHz. -6- Application Circuit 5.1k VOUT-B IC1 Tr1 100 2 2 ROG-G ROG-R 12V NC NC NC NC GND GND VOUT-B NC 2 ROG-R NC RS VOUT-R NC NC NC VOUT-G VDD 1 2 3 7 4 5 6 NC 8 9 1 10 100 100 2 Tr1 VOUT-G 5.1k 5.1k 1 ROG-B IC1: 74AC04 Tr1 : 2SC2785 Tr1 IC1 IC1 VOUT-R RS Data rate fRS = 1MHz Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. ROG-B 11 ROG-G 0.1F 47F/16V 22 20 21 19 18 17 16 15 14 13 12 -7- ILX533KB ILX533KB Example of Representative Characteristics (VDD = 12V, Ta = 25C) Spectral sensitivity characteristics (Standard characteristics) 1 0.8 Relative sensitivity 0.6 0.4 0.2 0 400 450 500 550 Wavelength [nm] 600 650 700 Dark signal output temperature characteristics (Standard characteristics) Integration time output voltage characteristics (Standard characteristics) 10 5 Output voltage rate Output voltage rate 1 1 0.5 0.5 0.1 0 10 20 30 40 50 60 Ta - Ambient temperature [C] 0.1 1 5 int - Integration time [ms] 10 Offset level vs. VDD characteristics (Standard characteristics) 12 Ta = 25C 10 10 12 Offset level vs. temperature characteristics (Standard characteristics) VOS - Offset level [V] 8 6 4 2 0 11.4 VOS - Offset level [V] 8 6 4 2 0 VOS Ta +0.5mV/C VOS VDD 0.6 12 VDD [V] 12.6 0 10 20 30 40 50 60 Ta - Ambient temperature [C] -8- ILX533KB Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm , , , Cover glass Plastic portion 39N 29N 29N 0.9Nm Ceramic portion (1) Adhesive (2) (3) (4) , b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. -9- ILX533KB 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 10 - Package Outline Unit: mm 22pin DIP(400mil) 32.0 0.3 22 12 5.0 0.3 H 11 0.25 1 30.6 10.0 0.3 No.1 Pixel (Green) 1. The height from the bottom to the sensor surface is 1.61 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. 4.0 0.5 2.10 2.54 0.3 M 0.51 PACKAGE STRUCTURE PACKAGE MATERIAL Plastic , Ceramic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE MASS 2.21g DRAWING NUMBER ILX533KB LS-D9(E) 2.80 0.5 10.16 V 9.0 0 to 9 5.8 0.3 21.6 (8mX2700Pixels) - 11 - |
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